激光锡球焊接工艺:
应用领域:
激光锡球焊锡机 | LAB730 |
机器外形尺寸Dimension | 980 * 1100 * 1780mm |
运动行程(X*Y *Z/C)Travel Range | 500 *650 *80/80mm |
产品最大尺寸 Product Max .Size | 200 *300/200 *300mm |
运动控制方式 Motion Control Mode | 微型工控机(IPC) |
驱动方式Drive Mode | 伺服马达/伺服丝杆 Servo r Motor/Ball Screw |
机器轴数Number of Axis | 6 Axes |
激光功率范围Laser Power Range | 0-300W |
最大移动速度Travel Maximum | 1000mm/s |
电源最大功耗Max Power Consumption | 185-265V/1500W |
电源平均功耗Average Power Consumption | 450W |
重复定位精度Repeat Position Accuracy | ±0 .01mm |
锡球范围Diameter of Solder Ball | 0.2-1.8mm |
总重量Weight | 700Kg |
激光光源种类Laser Type | 光纤 Fiber Laser |
最小焊接间距Minimum Soldering Distance | 0.2mm |
氮气压力Nitrogen Pressure | 3-12Bar |
氮气流速Nitrogen Flow Rate | 0.75L/min |