机器外形尺寸⼨Dimension

980 * 1100 * 1780mm

运动行程(X*Y *Z/C)Travel Range

500 *650 *80/80mm

产品最大尺寸Product Max .Size

200 *300/200 *300mm

运动控制方式Motion Control Mode

微型工控机(IPC)

驱动方式 Drive Mode

伺服马达/伺服丝杆 Servo r Motor/Ball Screw

机器轴数Number of Axis

6 Axes

激光功率范围Laser Power Range

0-300W

最大移动速度Travel Maximum

1000mm/s

电源最大功耗Max Power Consumption

185-265V/1500W

电源平均功耗Average Power Consumption

450W

重复定位精度Repeat Position Accuracy

±0 .02mm

锡丝范围Diameter of Solder Wire

0.3-2.0mm

锡粉直径Solder Powder Particle size

5-150um (Type1-Type6)

总重量Weight

700Kg

激光光源种类LaserType

半导体 Semiconductor Laser

最小焊接间距Minimum Soldering Distance

0.2mm

工作环境Work Environment

0-40℃不凝结  湿度10%-90%